Electrical-thermal co-simulation for DC IR-drop analysis of large-scale integrated circuits

Tianjian Lu, Jianming Jin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary in order to take into account the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method due to its capabilities in modeling complex geometries and materials. In order to deal with large-scale problems, a domain decomposition scheme is applied to the finite element method to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.

Original languageEnglish (US)
Title of host publication2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
PublisherIEEE Computer Society
Pages107-110
Number of pages4
ISBN (Print)9781467325363
DOIs
StatePublished - Jan 1 2013
Event2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 - San Jose, CA, United States
Duration: Oct 27 2013Oct 30 2013

Publication series

Name2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013

Other

Other2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
CountryUnited States
CitySan Jose, CA
Period10/27/1310/30/13

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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