Electrical-Thermal Co-Simulation for Analysis of High-Power RF/Microwave Components

Tianjian Lu, Jian Ming Jin

Research output: Contribution to journalArticlepeer-review


An electrical-thermal co-simulation based on the finite element method is presented for analysis of high-power RF/microwave circuits. The co-simulation integrates a full-wave electromagnetic analysis and a transient thermal analysis through an iterative scheme, and is devised for the design and analysis of RF/microwave circuits operated at high frequencies and high power levels. To enhance the efficiency in solving large-scale problems, a domain decomposition scheme called the finite element tearing and interconnecting and an adaptive time-stepping scheme based on the algorithm of proportional-integral-derivative control are incorporated into the co-simulation. Temperature stability analysis is performed with the proposed co-simulation for a matching network in high-power RF amplifiers and for a substrate integrated waveguide filter.

Original languageEnglish (US)
Article number7560653
Pages (from-to)93-102
Number of pages10
JournalIEEE Transactions on Electromagnetic Compatibility
Issue number1
StatePublished - Feb 2017


  • Domain decomposition
  • electrical-thermal co-simulation
  • finite element method (FEM)
  • substrate integrated waveguide (SIW)
  • temperature stability

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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