@inproceedings{9ce8df80c90244f3b4c7818479e68f21,
title = "Electrical-thermal co-analysis of through silicon via with equivalent circuit model",
abstract = "An electrical-thermal co-analysis method for through silicon via using equivalent circuit model is proposed in this paper. The electrical part is based on analytical methods, taking physical effects such as MOS effect, eddy current into consideration. The thermal part is realized by behavior modeling, which enables this method to perform transient analysis besides stationary analysis. The co-analysis can be conveniently conducted using existing electric circuit solvers. Accuracy and efficiency of the proposed method are demonstrated by comparison of simulation results with commercial software.",
keywords = "3-D IC, electrical-thermal co-analysis, equivalent circuit model, thermal-electrical analogy, through-silicon-via (TSV)",
author = "Qiu Min and Li, {Er Ping} and Cheng Zhuo and Li, {Yong Sheng} and Zhou, {Shi Yun} and Jin, {Jian Ming}",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 ; Conference date: 14-12-2017 Through 16-12-2017",
year = "2017",
month = jul,
day = "2",
doi = "10.1109/EDAPS.2017.8276944",
language = "English (US)",
series = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--4",
booktitle = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",
address = "United States",
}