Electrical modeling of global interconnects with electromagnetic accuracy

Research output: Contribution to journalConference articlepeer-review

Abstract

This paper presents a numerically stable integral equation methodology for the full-wave electromagnetic analysis of the three-dimensional interconnect networks, integrated passives and power distribution grids used in high-speed digital and mixed-signal integrated electronic systems. The proposed methodology is based on a generalized version of the Partial Element Equivalent Circuit (PEEC) interpretation of the electric field integral equation that utilizes triangular cells for the discretization of conductor surfaces and thus is capable of handling structures of arbitrary shapes. Furthermore, a mesh analysis formulation of the PEEC approximation is utilized to ensure the numerical stability of the solver at very low frequencies and thus enable broadband analysis with electromagnetic accuracy from dc to multi-GHz frequencies.

Original languageEnglish (US)
Pages (from-to)983-987
Number of pages5
JournalProceedings - Electronic Components and Technology Conference
StatePublished - Jul 17 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: May 27 2003May 30 2003

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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