Abstract
The explosive growth of wireless communications, combined with the rapid advances in high-performance portable computing, are driving the microelectronics industry toward the development of a variety of multi-functional, low-cost, compact, mixed-signal electronic products. These new products call for novel, often revolutionary, practices in functional block integration and packaging. Some of the challenges associated with the electrical design and rapid prototyping of these systems are discussed in this paper. Examples are given of existing electromagnetic modeling methodologies and associated CAD tools that can be used today to facilitate the design of these novel packages. The paper concludes with a brief discussion of on-going research activities toward the enhancement of these modeling/simulation methodologies and the eventual establishment of an electromagnetic CAD environment for mixed-signal system electrical design.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 82-94 |
| Number of pages | 13 |
| Journal | Proceedings of the Annual IEEE International Conference on Innovative Systems in Silicon |
| State | Published - 1997 |
| Event | Proceedings of the 1997 2nd Annual IEEE International Conference on Innovative Systems in Silicon - Austin, TX, USA Duration: Oct 8 1997 → Oct 10 1997 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Condensed Matter Physics