Electrical modeling and simulation challenges in chip-package codesign

Research output: Contribution to journalArticle

Abstract

High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach.

Original languageEnglish (US)
Pages (from-to)50-59
Number of pages10
JournalIEEE Micro
Volume18
Issue number4
DOIs
StatePublished - Jul 1 1998

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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