Electrical Characteristics of Multichip Module Interconnects with Perforated Reference Planes

Andreas C. Cangellaris; Michael Gribbons; John L. Prince

doi:10.1109/33.214867

Electrical Characteristics of Multichip Module Interconnects with Perforated Reference Planes

Andreas C. Cangellaris, Michael Gribbons, John L. Prince

Research output: Contribution to journal › Article › peer-review

Abstract

A quasi-TEM approach is demonstrated for the equivalent transmission line characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The proposed method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulation tools for an overall electrical analysis of complex MCM interconnect nets. Comparisons to experimental results obtained from the literature, as well as results obtained from full-wave modeling of the interconnect structures, demonstrate the validity of the proposed approach and help define the frequency range of its accuracy.

Original language	English (US)
Pages (from-to)	113-118
Number of pages	6
Journal	IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume	16
Issue number	1
DOIs	https://doi.org/10.1109/33.214867
State	Published - Feb 1993
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
General Engineering
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/33.214867

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abstract = "A quasi-TEM approach is demonstrated for the equivalent transmission line characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The proposed method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulation tools for an overall electrical analysis of complex MCM interconnect nets. Comparisons to experimental results obtained from the literature, as well as results obtained from full-wave modeling of the interconnect structures, demonstrate the validity of the proposed approach and help define the frequency range of its accuracy.",

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note = "Funding Information: Manuscript received May 20, 1992; revised October 8,1992. This paper was presented at the 42nd Electronic Components and Technology Conference, San Diego, CA, May 18-20, 1992. This work was supported in part by the Semiconductor Research Corporation under Grant 90-MP-86.",

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AU - Prince, John L.

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N2 - A quasi-TEM approach is demonstrated for the equivalent transmission line characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The proposed method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulation tools for an overall electrical analysis of complex MCM interconnect nets. Comparisons to experimental results obtained from the literature, as well as results obtained from full-wave modeling of the interconnect structures, demonstrate the validity of the proposed approach and help define the frequency range of its accuracy.

AB - A quasi-TEM approach is demonstrated for the equivalent transmission line characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The proposed method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulation tools for an overall electrical analysis of complex MCM interconnect nets. Comparisons to experimental results obtained from the literature, as well as results obtained from full-wave modeling of the interconnect structures, demonstrate the validity of the proposed approach and help define the frequency range of its accuracy.

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Electrical Characteristics of Multichip Module Interconnects with Perforated Reference Planes

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