Electrical characteristics of multichip module interconnects with perforated reference planes

A. C. Cangellaris, M. Gribbons, J. L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A quasi-TEM (transverse electromagnetic) approach is demonstrated for the equivalent transmission line characterization of multichip-module (MCM) interconnects with perforated (mesh) reference planes. The proposed method can be used to obtain effective transmission line parameters for both single and coupled interconnects, which in turn can be used directly in SPICE-like waveform simulator tools for an overall electrical analysis of complex MCM interconnect nets. Comparisons with experimental results obtained from the literature, as well as results obtained from full-wave modeling of the interconnect structures, demonstrate the validity of the proposed approach and help define the frequency range of its accuracy.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components Conference
PublisherPubl by IEEE
Pages725-729
Number of pages5
ISBN (Print)0818626607
StatePublished - Jan 1 1992
Externally publishedYes
EventProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
Duration: May 18 1992May 20 1992

Publication series

NameProceedings - Electronic Components Conference
ISSN (Print)0569-5503

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA
Period5/18/925/20/92

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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