Efficient pattern relocation for EUV blank defect mitigation

Hongbo Zhang, Yuelin Du, Martin D F Wong, Rasit O. Topalaglu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.

Original languageEnglish (US)
Title of host publicationASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference
Pages719-724
Number of pages6
DOIs
StatePublished - Apr 26 2012
Event17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012 - Sydney, NSW, Australia
Duration: Jan 30 2012Feb 2 2012

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012
CountryAustralia
CitySydney, NSW
Period1/30/122/2/12

Fingerprint

Relocation
Defects
Extreme ultraviolet lithography
Process control

ASJC Scopus subject areas

  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

Cite this

Zhang, H., Du, Y., Wong, M. D. F., & Topalaglu, R. O. (2012). Efficient pattern relocation for EUV blank defect mitigation. In ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference (pp. 719-724). [6165049] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2012.6165049

Efficient pattern relocation for EUV blank defect mitigation. / Zhang, Hongbo; Du, Yuelin; Wong, Martin D F; Topalaglu, Rasit O.

ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference. 2012. p. 719-724 6165049 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhang, H, Du, Y, Wong, MDF & Topalaglu, RO 2012, Efficient pattern relocation for EUV blank defect mitigation. in ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference., 6165049, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, pp. 719-724, 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, NSW, Australia, 1/30/12. https://doi.org/10.1109/ASPDAC.2012.6165049
Zhang H, Du Y, Wong MDF, Topalaglu RO. Efficient pattern relocation for EUV blank defect mitigation. In ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference. 2012. p. 719-724. 6165049. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2012.6165049
Zhang, Hongbo ; Du, Yuelin ; Wong, Martin D F ; Topalaglu, Rasit O. / Efficient pattern relocation for EUV blank defect mitigation. ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference. 2012. pp. 719-724 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).
@inproceedings{4cdcf981980c4377a5e574b859f0a7a5,
title = "Efficient pattern relocation for EUV blank defect mitigation",
abstract = "Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.",
author = "Hongbo Zhang and Yuelin Du and Wong, {Martin D F} and Topalaglu, {Rasit O.}",
year = "2012",
month = "4",
day = "26",
doi = "10.1109/ASPDAC.2012.6165049",
language = "English (US)",
isbn = "9781467307727",
series = "Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC",
pages = "719--724",
booktitle = "ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference",

}

TY - GEN

T1 - Efficient pattern relocation for EUV blank defect mitigation

AU - Zhang, Hongbo

AU - Du, Yuelin

AU - Wong, Martin D F

AU - Topalaglu, Rasit O.

PY - 2012/4/26

Y1 - 2012/4/26

N2 - Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.

AB - Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.

UR - http://www.scopus.com/inward/record.url?scp=84859993266&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84859993266&partnerID=8YFLogxK

U2 - 10.1109/ASPDAC.2012.6165049

DO - 10.1109/ASPDAC.2012.6165049

M3 - Conference contribution

AN - SCOPUS:84859993266

SN - 9781467307727

T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

SP - 719

EP - 724

BT - ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference

ER -