Efficient pattern relocation for EUV blank defect mitigation

Hongbo Zhang; Yuelin Du; Martin D.F. Wong; Rasit O. Topalaglu

doi:10.1109/ASPDAC.2012.6165049

Efficient pattern relocation for EUV blank defect mitigation

Hongbo Zhang, Yuelin Du, Martin D.F. Wong, Rasit O. Topalaglu

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.

Original language	English (US)
Title of host publication	ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference
Pages	719-724
Number of pages	6
DOIs	https://doi.org/10.1109/ASPDAC.2012.6165049
State	Published - 2012
Event	17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012 - Sydney, NSW, Australia Duration: Jan 30 2012 → Feb 2 2012

Publication series

Name	Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other	17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012
Country/Territory	Australia
City	Sydney, NSW
Period	1/30/12 → 2/2/12

ASJC Scopus subject areas

Computer Science Applications
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

Online availability

10.1109/ASPDAC.2012.6165049

Library availability

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Efficient pattern relocation for EUV blank defect mitigation. / Zhang, Hongbo; Du, Yuelin; Wong, Martin D.F. et al.
ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference. 2012. p. 719-724 6165049 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhang, H, Du, Y, Wong, MDF & Topalaglu, RO 2012, Efficient pattern relocation for EUV blank defect mitigation. in ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference., 6165049, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, pp. 719-724, 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, NSW, Australia, 1/30/12. https://doi.org/10.1109/ASPDAC.2012.6165049

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abstract = "Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.",

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AB - Blank defect mitigation is a critical step for extreme ultraviolet (EUV) lithography. Targeting the defective blank, a layout relocation method, to shift and rotate the whole layout pattern to a proper position, has been proved to be an effective way to reduce defect impact. Yet, there is still no published work about how to find the best pattern location to minimize the impact from the buried defects with reasonable defect model and considerable process variation control. In this paper, we successfully present an algorithm that can optimally solve this pattern relocation problem. Experimental results validate our method, and the relocation results with full scale layouts generated from Nangate Open Cell Library has shown great advantages with competitive runtimes compared to the existing commercial tool.

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Efficient pattern relocation for EUV blank defect mitigation

Abstract

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