Efficient method for the near-field electromagnetic scattering by buried objects

T. J. Cui, W. C. Chew

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The analysis of electromagnetic (EM) scattering by buried objects is complicated by the presence of the air-earth interface. Because Sommerfeld integrals are involved in the problem, its numerical implementation is also rather time consuming. The problem becomes even more complicated when the buried objects are detected by a transmitting antenna. The plane-wave scattering-matrix method provides a convenient means of combining the source, receiver, scatterer, and interface effects in a self-consistent formulation. However, it is only valid for weak dielectric objects by using the Born approximation. We present an efficient method for EM scattering by three-dimensional buried objects excited by linear transmitting antennas which is valid for both dielectric and conducting objects.

Original languageEnglish (US)
Title of host publicationIEEE Antennas and Propagation Society International Symposium, 1998 Digest - Antennas
Subtitle of host publicationGateways to the Global Network - Held in conjunction with: USNC/URSI National Radio Science Meeting
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages982-985
Number of pages4
ISBN (Print)0780344782, 9780780344785
DOIs
StatePublished - Jan 1 1998
Event1998 IEEE Antennas and Propagation Society International Symposium, APSURSI 1998 - Atlanta, United States
Duration: Jun 21 1998Jun 26 1998

Publication series

NameIEEE Antennas and Propagation Society International Symposium, 1998 Digest - Antennas: Gateways to the Global Network - Held in conjunction with: USNC/URSI National Radio Science Meeting
Volume2

Other

Other1998 IEEE Antennas and Propagation Society International Symposium, APSURSI 1998
CountryUnited States
CityAtlanta
Period6/21/986/26/98

ASJC Scopus subject areas

  • Instrumentation
  • Radiation
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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