Abstract
A novel domain decomposition-model-order reduction method is proposed for efficient full-wave finite-element analysis of multilayer interconnection structures. By considering the special properties of a multilayer structure, the field at each nonmetallic interface (via-holes or other apertures) can be approximated with a modal expansion to establish a boundary condition and decompose the entire computational domain into separate layers. The coupling between each dielectric layer is taken into account through a mode-matching process. To further speed up the computation in each layer, the solution space projection, which is a multipoint model-order reduction method, is integrated into the aforementioned domain decomposition method to form a complete solution algorithm. With the aid of reduced-order models, the domain decomposition process at each frequency is accelerated and a fast broadband analysis is achieved. This domain decomposition-model-order reduction method, called approximate modal interface-solution space projection, is implemented using the finite-element method and validated through several examples, which demonstrate the efficiency of the method in both the computation time and memory usage.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 121-130 |
| Number of pages | 10 |
| Journal | IEEE Transactions on Microwave Theory and Techniques |
| Volume | 56 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2008 |
Keywords
- Domain decomposition
- Finite-element method (FEM)
- Full-wave analysis
- Model-order reduction
- Printed circuit board (PCB)
- Via-hole
ASJC Scopus subject areas
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering
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