Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method

Shih Hao Lee; Jian Ming Jin

doi:10.1109/EPEP.2007.4387126

Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An efficient domain decomposition-model order reduction method is proposed for a fast broadband finite-element analysis of multilayer interconnection structures. Significant enhancement in the computational efficiency is achieved while still maintaining the strong capability of geometry and material modeling as well as the full-wave accuracy.

Original language	English (US)
Title of host publication	IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Pages	69-72
Number of pages	4
DOIs	https://doi.org/10.1109/EPEP.2007.4387126
State	Published - 2007
Event	IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP - Atlanta, GA, United States Duration: Oct 29 2007 → Oct 31 2007

Publication series

Name	IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Other

Other	IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Country/Territory	United States
City	Atlanta, GA
Period	10/29/07 → 10/31/07

ASJC Scopus subject areas

General Engineering

Online availability

10.1109/EPEP.2007.4387126

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Lee, S. H., & Jin, J. M. (2007). Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method. In IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP (pp. 69-72). Article 4387126 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging). https://doi.org/10.1109/EPEP.2007.4387126

Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method. / Lee, Shih Hao; Jin, Jian Ming.
IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP. 2007. p. 69-72 4387126 (IEEE Topical Meeting on Electrical Performance of Electronic Packaging).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lee, SH & Jin, JM 2007, Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method. in IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP., 4387126, IEEE Topical Meeting on Electrical Performance of Electronic Packaging, pp. 69-72, IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, Atlanta, GA, United States, 10/29/07. https://doi.org/10.1109/EPEP.2007.4387126

@inproceedings{ba51eb44012b43499399117d1ced4e55,

title = "Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method",

abstract = "An efficient domain decomposition-model order reduction method is proposed for a fast broadband finite-element analysis of multilayer interconnection structures. Significant enhancement in the computational efficiency is achieved while still maintaining the strong capability of geometry and material modeling as well as the full-wave accuracy.",

author = "Lee, {Shih Hao} and Jin, {Jian Ming}",

year = "2007",

doi = "10.1109/EPEP.2007.4387126",

language = "English (US)",

isbn = "1424408830",

series = "IEEE Topical Meeting on Electrical Performance of Electronic Packaging",

pages = "69--72",

booktitle = "IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP",

note = "IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP ; Conference date: 29-10-2007 Through 31-10-2007",

}

TY - GEN

T1 - Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method

AU - Lee, Shih Hao

AU - Jin, Jian Ming

PY - 2007

Y1 - 2007

N2 - An efficient domain decomposition-model order reduction method is proposed for a fast broadband finite-element analysis of multilayer interconnection structures. Significant enhancement in the computational efficiency is achieved while still maintaining the strong capability of geometry and material modeling as well as the full-wave accuracy.

AB - An efficient domain decomposition-model order reduction method is proposed for a fast broadband finite-element analysis of multilayer interconnection structures. Significant enhancement in the computational efficiency is achieved while still maintaining the strong capability of geometry and material modeling as well as the full-wave accuracy.

UR - http://www.scopus.com/inward/record.url?scp=47949090193&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=47949090193&partnerID=8YFLogxK

U2 - 10.1109/EPEP.2007.4387126

DO - 10.1109/EPEP.2007.4387126

M3 - Conference contribution

AN - SCOPUS:47949090193

SN - 1424408830

SN - 9781424408832

T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging

SP - 69

EP - 72

BT - IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP

T2 - IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP

Y2 - 29 October 2007 through 31 October 2007

ER -

Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition-model order reduction method

Abstract

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