Effects of organic and metal contamination on the etch rate of acid baths - Implications for extended acid use

Andre Ellis, Jennifer Deluhery, Nandakishore Rajagopalan

Research output: Contribution to specialist publicationArticle

Abstract

Appreciable quantities of hazardous acid wastes are generated during electroplating operations. These acids are typically disposed of when their etching rates have dropped below some critical threshold. It has often been assumed that the acid etch rates are primarily limited by the build-up in metals concentration. In this paper, we demonstrate that acid etch rates are highly sensitive to the presence of organic/ colloidal impurities. Consequently, the removal of such impurities by soluble silicates, ultrafiltration or carbon adsorption improves the etch rates of acids even in the presence of substantial metal contamination.

Original languageEnglish (US)
Pages42-47
Number of pages6
Volume92
No2
Specialist publicationPlating and Surface Finishing
StatePublished - Feb 1 2005

ASJC Scopus subject areas

  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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