Abstract
Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper investigates these effects using several tools developed at the University of Arizona.
Original language | English (US) |
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Pages | 153-156 |
Number of pages | 4 |
State | Published - 1997 |
Externally published | Yes |
Event | Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging - San Jose, CA, USA Duration: Oct 27 1997 → Oct 29 1997 |
Other
Other | Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging |
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City | San Jose, CA, USA |
Period | 10/27/97 → 10/29/97 |
ASJC Scopus subject areas
- General Engineering