Effects of heat spreader on electrical characteristics of tape-BGA packages

Samil Hasan, Andreas Cangellaris, Ravi Kaw, William Pinello

Research output: Contribution to conferencePaperpeer-review

Abstract

Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper investigates these effects using several tools developed at the University of Arizona.

Original languageEnglish (US)
Pages153-156
Number of pages4
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging - San Jose, CA, USA
Duration: Oct 27 1997Oct 29 1997

Other

OtherProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging
CitySan Jose, CA, USA
Period10/27/9710/29/97

ASJC Scopus subject areas

  • General Engineering

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