Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise

Loizos Vakanas; Samil Hasan; Andreas Cangellaris; John Prince

doi:10.1109/ECTC.1997.606265

Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise

Loizos Vakanas
, Samil Hasan
, Andreas Cangellaris
, John Prince

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The effects of floating conductors in three-dimensional packaging structures are investigated. The simulations are based on a frequency-dependent integral equation formulation for the calculation of the magnetoquasistatic current distribution in complex interconnect structures. The calculated current distributions are used to develop an inductance/resistance equivalent circuit representation of the package that can be used as a subcircuit in SPICE for simultaneous switching noise calculations. The model is frequency dependent and captures the effect that multiple solid/meshed ground/power planes, pins, vias and traces have on overall package inductive performance. The impact of floating planes, such as a heat spreader under a BGA structure, on the mutual inductances of the structure is demonstrated. The frequency dependence of the floating plane effects is examined also. The behavior of the induced eddy currents in the floating plane is investigated also, particularly in the vicinity of interconnect discontinuities. Switching noise results obtained using SPICE simulation and the generated inductance/resistance equivalent package models show the effects of floating planes on switching noise.

Original language	English (US)
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	IEEE
Pages	826-831
Number of pages	6
ISBN (Print)	078033857X
DOIs	https://doi.org/10.1109/ECTC.1997.606265
State	Published - 1997
Externally published	Yes
Event	Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA Duration: May 18 1997 → May 21 1997

Conference

Conference	Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference
City	San Jose, CA, USA
Period	5/18/97 → 5/21/97

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Online availability

10.1109/ECTC.1997.606265

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Vakanas, L, Hasan, S, Cangellaris, A & Prince, J 1997, Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 826-831, Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference, San Jose, CA, USA, 5/18/97. https://doi.org/10.1109/ECTC.1997.606265

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title = "Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise",

abstract = "The effects of floating conductors in three-dimensional packaging structures are investigated. The simulations are based on a frequency-dependent integral equation formulation for the calculation of the magnetoquasistatic current distribution in complex interconnect structures. The calculated current distributions are used to develop an inductance/resistance equivalent circuit representation of the package that can be used as a subcircuit in SPICE for simultaneous switching noise calculations. The model is frequency dependent and captures the effect that multiple solid/meshed ground/power planes, pins, vias and traces have on overall package inductive performance. The impact of floating planes, such as a heat spreader under a BGA structure, on the mutual inductances of the structure is demonstrated. The frequency dependence of the floating plane effects is examined also. The behavior of the induced eddy currents in the floating plane is investigated also, particularly in the vicinity of interconnect discontinuities. Switching noise results obtained using SPICE simulation and the generated inductance/resistance equivalent package models show the effects of floating planes on switching noise.",

author = "Loizos Vakanas and Samil Hasan and Andreas Cangellaris and John Prince",

year = "1997",

doi = "10.1109/ECTC.1997.606265",

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AU - Vakanas, Loizos

AU - Hasan, Samil

AU - Cangellaris, Andreas

AU - Prince, John

PY - 1997

Y1 - 1997

N2 - The effects of floating conductors in three-dimensional packaging structures are investigated. The simulations are based on a frequency-dependent integral equation formulation for the calculation of the magnetoquasistatic current distribution in complex interconnect structures. The calculated current distributions are used to develop an inductance/resistance equivalent circuit representation of the package that can be used as a subcircuit in SPICE for simultaneous switching noise calculations. The model is frequency dependent and captures the effect that multiple solid/meshed ground/power planes, pins, vias and traces have on overall package inductive performance. The impact of floating planes, such as a heat spreader under a BGA structure, on the mutual inductances of the structure is demonstrated. The frequency dependence of the floating plane effects is examined also. The behavior of the induced eddy currents in the floating plane is investigated also, particularly in the vicinity of interconnect discontinuities. Switching noise results obtained using SPICE simulation and the generated inductance/resistance equivalent package models show the effects of floating planes on switching noise.

AB - The effects of floating conductors in three-dimensional packaging structures are investigated. The simulations are based on a frequency-dependent integral equation formulation for the calculation of the magnetoquasistatic current distribution in complex interconnect structures. The calculated current distributions are used to develop an inductance/resistance equivalent circuit representation of the package that can be used as a subcircuit in SPICE for simultaneous switching noise calculations. The model is frequency dependent and captures the effect that multiple solid/meshed ground/power planes, pins, vias and traces have on overall package inductive performance. The impact of floating planes, such as a heat spreader under a BGA structure, on the mutual inductances of the structure is demonstrated. The frequency dependence of the floating plane effects is examined also. The behavior of the induced eddy currents in the floating plane is investigated also, particularly in the vicinity of interconnect discontinuities. Switching noise results obtained using SPICE simulation and the generated inductance/resistance equivalent package models show the effects of floating planes on switching noise.

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BT - Proceedings - Electronic Components and Technology Conference

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Y2 - 18 May 1997 through 21 May 1997

ER -

Effects of floating planes in three-dimensional packaging structures on simultaneous switching noise

Abstract

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ASJC Scopus subject areas

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