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Effects of discontinuities (vias) on high speed interconnects
Srinivas Venkataraman
, John L. Prince
, Andreas C. Cangellaris
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Keyphrases
Thick Film
100%
Film Geometry
100%
Signal Distortion
100%
Rise Time
100%
Time Signal
100%
Energy Storage Devices
100%
Matrix Parameter
100%
Transmission Line System
100%
Propagation Delay
100%
Characteristic Impedance
100%
High-speed Interconnects
100%
Three-dimensional Parameters
100%
Signal Propagation Speed
100%
Parameter Extractor
100%
Distortion Characteristics
100%
Reactive Energy
100%
ABCD Matrix
100%
Engineering
Delay Time
100%
Interconnects
100%
Rise Time
100%
Stored Energy
100%
Electric Lines
100%
Propagation Characteristic
100%
Line System
100%
Propagation Delay
100%
Characteristic Impedance
100%
Extractor
100%