Effects of discontinuities (vias) on high speed interconnects

Srinivas Venkataraman, John L. Prince, Andreas C. Cangellaris

Research output: Contribution to conferencePaper

Abstract

The extent of degradation of signal propagation characteristics due to the presence of discontinuities (or vias) has been investigated by developing and using a simulator based on the transmission (ABCD) matrix parameters, which facilitates concatenation of many transmission line systems. The approach models the reactive energy stored in a discontinuity as a lumped tee-network using three dimensional parameter extractors. A case study on the thick film geometry of the IBM ES9000 module investigates the effects of vias on propagation delay time, signal distortion, characteristic impedance and additional noise generated due to reflections at the termination and at the source for different input rise times.

Original languageEnglish (US)
Pages79-82
Number of pages4
StatePublished - Dec 1 1994
EventProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA
Duration: Nov 2 1994Nov 4 1994

Other

OtherProceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging
CityMonterey, CA, USA
Period11/2/9411/4/94

ASJC Scopus subject areas

  • Engineering(all)

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    Venkataraman, S., Prince, J. L., & Cangellaris, A. C. (1994). Effects of discontinuities (vias) on high speed interconnects. 79-82. Paper presented at Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, USA, .