Abstract
The extent of degradation of signal propagation characteristics due to the presence of discontinuities (or vias) has been investigated by developing and using a simulator based on the transmission (ABCD) matrix parameters, which facilitates concatenation of many transmission line systems. The approach models the reactive energy stored in a discontinuity as a lumped tee-network using three dimensional parameter extractors. A case study on the thick film geometry of the IBM ES9000 module investigates the effects of vias on propagation delay time, signal distortion, characteristic impedance and additional noise generated due to reflections at the termination and at the source for different input rise times.
Original language | English (US) |
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Pages | 79-82 |
Number of pages | 4 |
State | Published - 1994 |
Externally published | Yes |
Event | Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA Duration: Nov 2 1994 → Nov 4 1994 |
Other
Other | Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging |
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City | Monterey, CA, USA |
Period | 11/2/94 → 11/4/94 |
ASJC Scopus subject areas
- General Engineering