Effect of the microstructure orientation on tensile properties of Sn-Ag-Cu solder

Keyphrases

• Ag3Sn 20%
• Bridgman Method 20%
• Cross-slip 20%
• Equiaxed 20%
• Growth Direction 100%
• Horizontal Furnace 20%
• Lead-free 20%
• Microstructural Orientation 20%
• Microstructure Orientation 100%
• Miniaturization 20%
• Needle-like 20%
• Polished Surface 20%
• Slip Line 40%
• Slip System 20%
• Sn-Ag-Cu Solder 100%
• Solder Joint 20%
• Soldering 20%
• Strain Rate 20%
• Tensile Properties 100%
• Tensile Strain 20%
• Tensile Strength 20%
• Tensile Test 20%

Engineering

• Cross Slip 33%
• Joints (Structural Components) 33%
• Microstructure 100%
• Slip Line 66%
• Slip System 33%
• Strain Rate 33%
• Tensile Property 100%
• Tensile Strain 33%
• Tensile Test 33%
• Ultimate Tensile Strength 33%

Material Science

• Crystal Growth From Melt 50%
• Mechanical Strength 50%
• Solder Joint 50%
• Strain Rate 50%
• Tensile Property 100%
• Tensile Strain 50%
• Tin 50%
• Ultimate Tensile Strength 50%