Effect of the microstructure orientation on tensile properties of Sn-Ag-Cu solder

H. Y. Liu, Q. S. Zhu, Z. G. Wang, Jian Ku Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Effect of the microstructure orientation on tensile properties of Sn-Ag-Cu solder'. Together they form a unique fingerprint.

Engineering & Materials Science