Effect of the microstructure orientation on tensile properties of Sn-Ag-Cu solder

H. Y. Liu, Q. S. Zhu, Z. G. Wang, J. K. Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

With the miniaturization of the solder joint, the dependence of the property on the microstructure orientation has become increasingly notable. In this work, a lead-free Sn3.8Ag0.7Cu solders with certain microstructure orientation were processed by the Bridgman method in a horizontal furnace. After tensile tests at different strain rates, it was found that the tensile strengths of the materials were strongly dependent on the growth direction. The strength of the sample with a gauge perpendicular to the growth direction was much lower than that parallel to the growth direction. While the radial Cu 6Sn5 and Ag3Sn IMCs were distributed uniformly around the equiaxed tin grains perpendicular to the growth direction, the well-arranged needle shaped IMCs were oriented along the growth direction. At an applied tensile strain of 20%, the cross-slip lines were found throughout the polished surface and then impinged to the IMCs, resulting in the breaking of the IMCs. The variation of the tensile property with microstructural orientation may be attributed to the modification of the mobile slip system and the interaction of the slip lines with the IMC phase.

Original languageEnglish (US)
Title of host publicationProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Pages464-466
Number of pages3
DOIs
StatePublished - 2010
Externally publishedYes
Event2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, China
Duration: Aug 16 2010Aug 19 2010

Publication series

NameProceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Other

Other2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Country/TerritoryChina
CityXi'an
Period8/16/108/19/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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