Effect of RF plasma exposure on silver nanoparticle layer

Hyunseok Kim; Kwon Yong Shin; Heui Seok Kang; Sang Ho Lee; Jung Mu Kim

doi:10.1007/s00542-015-2595-3

Effect of RF plasma exposure on silver nanoparticle layer

Hyunseok Kim, Kwon Yong Shin, Heui Seok Kang, Sang Ho Lee, Jung Mu Kim

Research output: Contribution to journal › Article › peer-review

Abstract

We studied the effects of various plasma etching gases on a silver nanoparticle (AgNP) layer to find the proper etching conditions compatible with the AgNP printing process. An AgNP layer with thickness of 1.4 μm was prepared by spin-coating a AgNP suspension on a glass wafer; O₂, CF₄, and SF₆ plasma were then individually treated on the AgNP layer for 1 min and for 10 min. The surface properties, elemental composition, and sheet resistance were measured in order to study the effects of plasma exposure on AgNP layer. Small particles and deposited materials were observed on the surface after treating with O₂ and CF₄ plasma, respectively, while large particles were grown by re-crystallization after SF₆ plasma exposure. In summary, O₂ plasma has the least damage to the AgNP layer, showing good surface properties and sheet resistance. CF₄ plasma showed moderate results, and the SF₆ plasma severely damaged the AgNP layer.

Original language	English (US)
Pages (from-to)	1135-1142
Number of pages	8
Journal	Microsystem Technologies
Volume	22
Issue number	5
DOIs	https://doi.org/10.1007/s00542-015-2595-3
State	Published - May 1 2016
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Hardware and Architecture
Electrical and Electronic Engineering

Online availability

10.1007/s00542-015-2595-3

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abstract = "We studied the effects of various plasma etching gases on a silver nanoparticle (AgNP) layer to find the proper etching conditions compatible with the AgNP printing process. An AgNP layer with thickness of 1.4 μm was prepared by spin-coating a AgNP suspension on a glass wafer; O2, CF4, and SF6 plasma were then individually treated on the AgNP layer for 1 min and for 10 min. The surface properties, elemental composition, and sheet resistance were measured in order to study the effects of plasma exposure on AgNP layer. Small particles and deposited materials were observed on the surface after treating with O2 and CF4 plasma, respectively, while large particles were grown by re-crystallization after SF6 plasma exposure. In summary, O2 plasma has the least damage to the AgNP layer, showing good surface properties and sheet resistance. CF4 plasma showed moderate results, and the SF6 plasma severely damaged the AgNP layer.",

author = "Hyunseok Kim and Shin, {Kwon Yong} and Kang, {Heui Seok} and Lee, {Sang Ho} and Kim, {Jung Mu}",

note = "Publisher Copyright: {\textcopyright} 2015, Springer-Verlag Berlin Heidelberg.",

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doi = "10.1007/s00542-015-2595-3",

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AU - Kim, Hyunseok

AU - Shin, Kwon Yong

AU - Kang, Heui Seok

AU - Lee, Sang Ho

AU - Kim, Jung Mu

PY - 2016/5/1

Y1 - 2016/5/1

N2 - We studied the effects of various plasma etching gases on a silver nanoparticle (AgNP) layer to find the proper etching conditions compatible with the AgNP printing process. An AgNP layer with thickness of 1.4 μm was prepared by spin-coating a AgNP suspension on a glass wafer; O2, CF4, and SF6 plasma were then individually treated on the AgNP layer for 1 min and for 10 min. The surface properties, elemental composition, and sheet resistance were measured in order to study the effects of plasma exposure on AgNP layer. Small particles and deposited materials were observed on the surface after treating with O2 and CF4 plasma, respectively, while large particles were grown by re-crystallization after SF6 plasma exposure. In summary, O2 plasma has the least damage to the AgNP layer, showing good surface properties and sheet resistance. CF4 plasma showed moderate results, and the SF6 plasma severely damaged the AgNP layer.

AB - We studied the effects of various plasma etching gases on a silver nanoparticle (AgNP) layer to find the proper etching conditions compatible with the AgNP printing process. An AgNP layer with thickness of 1.4 μm was prepared by spin-coating a AgNP suspension on a glass wafer; O2, CF4, and SF6 plasma were then individually treated on the AgNP layer for 1 min and for 10 min. The surface properties, elemental composition, and sheet resistance were measured in order to study the effects of plasma exposure on AgNP layer. Small particles and deposited materials were observed on the surface after treating with O2 and CF4 plasma, respectively, while large particles were grown by re-crystallization after SF6 plasma exposure. In summary, O2 plasma has the least damage to the AgNP layer, showing good surface properties and sheet resistance. CF4 plasma showed moderate results, and the SF6 plasma severely damaged the AgNP layer.

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Effect of RF plasma exposure on silver nanoparticle layer

Abstract

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