Effect of load-mix on fatigue crack growth in Sn-Pb solder joint

Daping Yao, Jian Ku Shang

Research output: Contribution to journalConference articlepeer-review


Fatigue crack growth at the interface between Sn-Pb solder and Cu was examined under various mixed-mode conditions. The load-mix, in terms of the ratio of Mode-II to Mode-I strain energy release rates, was systematically changed by varying the thickness ratio of Cu layers in the flexural-peel specimens made from Sn-Pb/Cu joints. Fatigue crack growth experiments were conducted using a sinusoidal waveform at a frequency of a load-ratio of zero and a frequency of 5 Hz. Fatigue crack growth rates were measured as a function of the total strain energy release rates for a given load-mix. Fatigue crack growth resistance was found to increase with the load-mix, with the effect of the load-mix being more pronounced in the near-threshold regime. The effect of the load-mix on fatigue crack growth is shown to result from shear-enhanced frictional sliding of fatigue crack surfaces.

Original languageEnglish (US)
Pages (from-to)8
Number of pages8
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - 1995
EventProceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA
Duration: Nov 12 1995Nov 17 1995

ASJC Scopus subject areas

  • Mechanical Engineering


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