Effect of load-mix on fatigue crack growth in 63sn-37pb solder joints

D. Yao, J. K. Shang

Research output: Contribution to journalArticlepeer-review


Fatigue crack growth at the interface between Sn-Pb solder and Cu was examined under various mixed-mode conditions. The load-mix, in terms of the ratio of Mode- H to Mode-I stress intensities, was systematically changed by varying the thickness ratio of Cu layers in the flexural-peel specimens made.from Sn-Pb/Cu joints. Fatigue crack growth experiments were conducted using a sinusoidal waveform at a frequency of 5 Hz and a load-ratio of zero. Fatigue crack growth rates were measured as a function of the total strain energy release rates for a given load-mix. Fatigue crack growth resistance was found to increase with the load-mix, with the effect of the load-mix being more pronounced in the near-threshold regime. The effect of the loadmix on fatigue crack growth is shown to result.from shear-enhanced frictional sliding of fatigue crack surfaces.

Original languageEnglish (US)
Pages (from-to)114-118
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Issue number2
StatePublished - Jun 1997

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering


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