Abstract
Fatigue crack growth at the interface between Sn-Pb solder and Cu was examined under various mixed-mode conditions. The load-mix, in terms of the ratio of Mode- H to Mode-I stress intensities, was systematically changed by varying the thickness ratio of Cu layers in the flexural-peel specimens made.from Sn-Pb/Cu joints. Fatigue crack growth experiments were conducted using a sinusoidal waveform at a frequency of 5 Hz and a load-ratio of zero. Fatigue crack growth rates were measured as a function of the total strain energy release rates for a given load-mix. Fatigue crack growth resistance was found to increase with the load-mix, with the effect of the load-mix being more pronounced in the near-threshold regime. The effect of the loadmix on fatigue crack growth is shown to result.from shear-enhanced frictional sliding of fatigue crack surfaces.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 114-118 |
| Number of pages | 5 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 119 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jun 1997 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering