The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in Sn-Pb/Cu joints. Model interfaces of different roughnesses were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the Sn-Pb/Cu interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.
|Original language||English (US)|
|Journal||American Society of Mechanical Engineers (Paper)|
|State||Published - 1995|
ASJC Scopus subject areas
- Mechanical Engineering