Abstract
The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in Sn-Pb/Cu joints. Model interfaces of different roughnesses were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the Sn-Pb/Cu interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 6 |
| Number of pages | 6 |
| Journal | American Society of Mechanical Engineers (Paper) |
| State | Published - 1995 |
| Event | Proceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA Duration: Nov 12 1995 → Nov 17 1995 |
ASJC Scopus subject areas
- Mechanical Engineering