Effect of interface roughness on fatigue crack growth in Sn-Pb solder joints

Jian Ku Shang, Daping Yao

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in Sn-Pb/Cu joints. Model interfaces of different roughnesses were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the Sn-Pb/Cu interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.

Original languageEnglish (US)
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - 1995

ASJC Scopus subject areas

  • Mechanical Engineering

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