Effect of interface roughness on fatigue crack growth in sn-pb solder joints

J. K. Shang, Daping Yao

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in 63Sn-37Pb solder joints. Model interfaces with different values of roughness were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.

Original languageEnglish (US)
Pages (from-to)170-173
Number of pages4
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume118
Issue number3
DOIs
StatePublished - Sep 1996

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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