Abstract
The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in 63Sn-37Pb solder joints. Model interfaces with different values of roughness were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 170-173 |
| Number of pages | 4 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 118 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 1996 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering