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Effect of Halides on MPS Orientation and Cu Deposition Rates at Cu Surfaces
Gavin S. Lindsay
, Ralf Schmidt
, Christian Wendeln
,
Andrew A. Gewirth
Chemistry
Materials Research Lab
Research output
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peer-review
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Keyphrases
Cu Surface
100%
Deposition Rate
100%
Cu Deposition
100%
3-mercapto-1-propanesulfonate
100%
Halide Effect
100%
Reduction Rate
75%
Cu2+ Reduction
75%
Surface-enhanced Raman Spectroscopy
50%
Hydrophobicity
50%
In Situ
25%
Measurement Angle
25%
Contact Angle
25%
Halides
25%
Cu Electrodeposition
25%
Electrochemical Measurements
25%
Contact Angle Measurement
25%
Decorative Surfaces
25%
Sulphate Bath
25%
Acid Sulfate
25%
Electrodeposition Rate
25%
Material Science
Halide
100%
Surface-Enhanced Raman Spectroscopy
66%
Contact Angle
66%
Hydrophobicity
66%
Electrodeposition
33%
Surface (Surface Science)
33%
Chemistry
Halide
100%
Surface Enhanced Raman Spectroscopy
66%
Hydrophobicity
66%
Sulfate
33%
Electrodeposition
33%
Chemical Engineering
Angle Measurement
100%
Deposition Rate
100%
Electrodeposition
100%