Effect of geometry on void formation in commercial electroplating of thin strips to copper

M. K. Okelman, B. G. Thomas, M. Powers

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Effect of geometry on void formation in commercial electroplating of thin strips to copper'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds