Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

X. F. Zhang, J. D. Guo, J. K. Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Interfacial reactions from high-density electric currents were investigated in a eutectic SnZn solder/Cu interconnect. An abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was thicker than that at the anode. A kinetic model, based on the Zn mass transport in the sample, was presented to explain the growth of the intermetallic compound at the anode and cathode. The back stress induced by electromigration of Sn in the solder interconnect is considered to drive Zn atoms drift to cathode.

Original languageEnglish (US)
Title of host publicationProceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs
StatePublished - Dec 1 2007
Event2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China
Duration: Aug 14 2007Aug 17 2007

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2007 8th International Conference on Electronic Packaging Technology, ICEPT
CountryChina
CityShanghai
Period8/14/078/17/07

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Zhang, X. F., Guo, J. D., & Shang, J. K. (2007). Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect. In Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT [4441519] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/ICEPT.2007.4441519