Effect of electromigration on interfacial reactions in 90Sn-10Sb pb-free solder joints

X. N. Du; J. D. Guo; J. K. Shang

doi:10.1007/s11664-009-0917-x

Effect of electromigration on interfacial reactions in 90Sn-10Sb pb-free solder joints

X. N. Du, J. D. Guo, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu ₃Sn and Cu ₆Sn ₅ intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140°C, the thickness of the Cu ₆Sn ₅ IMC at the anode increased significantly. Sn ₃Sb ₂ IMC coarsened in the Cu ₆Sn ₅ IMC at the anode and in the β-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.

Original language	English (US)
Pages (from-to)	2398-2404
Number of pages	7
Journal	Journal of Electronic Materials
Volume	38
Issue number	11
DOIs	https://doi.org/10.1007/s11664-009-0917-x
State	Published - Nov 2009
Externally published	Yes

Keywords

Electromigration
Intermetallic compound
Solder joint

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Online availability

10.1007/s11664-009-0917-x

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title = "Effect of electromigration on interfacial reactions in 90Sn-10Sb pb-free solder joints",

abstract = "The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu 3Sn and Cu 6Sn 5 intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140°C, the thickness of the Cu 6Sn 5 IMC at the anode increased significantly. Sn 3Sb 2 IMC coarsened in the Cu 6Sn 5 IMC at the anode and in the β-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.",

keywords = "Electromigration, Intermetallic compound, Solder joint",

author = "Du, {X. N.} and Guo, {J. D.} and Shang, {J. K.}",

note = "Funding Information: This study was supported by the National Natural Science Foundation of China under Grant No. 50228101 and the National Basic Research Program of China, Grant No. 2004CB619306. The experimental help of Q. L. Yang and X. F. Zhang is greatly acknowledged.",

year = "2009",

month = nov,

doi = "10.1007/s11664-009-0917-x",

language = "English (US)",

volume = "38",

pages = "2398--2404",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

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T1 - Effect of electromigration on interfacial reactions in 90Sn-10Sb pb-free solder joints

AU - Du, X. N.

AU - Guo, J. D.

AU - Shang, J. K.

N1 - Funding Information: This study was supported by the National Natural Science Foundation of China under Grant No. 50228101 and the National Basic Research Program of China, Grant No. 2004CB619306. The experimental help of Q. L. Yang and X. F. Zhang is greatly acknowledged.

PY - 2009/11

Y1 - 2009/11

N2 - The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu 3Sn and Cu 6Sn 5 intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140°C, the thickness of the Cu 6Sn 5 IMC at the anode increased significantly. Sn 3Sb 2 IMC coarsened in the Cu 6Sn 5 IMC at the anode and in the β-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.

AB - The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu 3Sn and Cu 6Sn 5 intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140°C, the thickness of the Cu 6Sn 5 IMC at the anode increased significantly. Sn 3Sb 2 IMC coarsened in the Cu 6Sn 5 IMC at the anode and in the β-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.

KW - Electromigration

KW - Intermetallic compound

KW - Solder joint

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JF - Journal of Electronic Materials

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ER -

Effect of electromigration on interfacial reactions in 90Sn-10Sb pb-free solder joints

Abstract

Keywords

ASJC Scopus subject areas

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