Effect of electrodeposition conditions on the properties of Cu-Si₃N₄ composite coatings

Keyphrases

• Silicon Nitride 100%
• Composite Coating 100%
• Electrodeposition Condition 100%
• Si3N4 Composites 100%
• Cu-Si 40%
• Surfactant 20%
• Copper Deposit 20%
• Mechanical Properties 20%
• Microstructural Properties 20%
• Low Friction Coefficient 20%
• Particle Concentration 20%
• Pure Copper 20%
• Friction Wear 20%
• Crystal Face 20%
• Copper Sulfate 20%
• Dispersion Strengthening 20%
• Stirring Rate 20%
• Copper Matrix 20%
• Sulphate Bath 20%
• Grain Refinement Strengthening 20%
• Wear Loss 20%
• Preferred Orientation Growth 20%
• Electroplating Parameter 20%
• Co-electrodeposition 20%

Material Science

• Electrodeposition 100%
• Silicon Nitride 100%
• Composite Coating 100%
• Surface Active Agent 33%
• Grain Refinement 33%
• Electroplating 33%