Effect of electrodeposition conditions on the properties of Cu-Si3N4                          composite coatings

Maryam Eslami; Hassan Saghafian; Farhad Golestani-Fard; Alain Robin

doi:10.1016/j.apsusc.2014.02.021

Effect of electrodeposition conditions on the properties of Cu-Si₃N₄ composite coatings

Maryam Eslami, Hassan Saghafian, Farhad Golestani-Fard, Alain Robin

Research output: Contribution to journal › Article › peer-review

Abstract

Cu-Si ₃ N ₄ composite coatings were obtained by co-electrodeposition under DC conditions from a copper sulphate bath containing suspended Si ₃ N ₄ particles. The effect of some electroplating parameters such as surfactant (SDS) concentration, stirring rate, and particle concentration on microstructural and mechanical properties of the coatings was investigated. The incorporation of Si ₃ N ₄ particles into the copper matrix resulted in the production of coatings with finer copper grains. The incorporation of Si ₃ N ₄ particles also led to a change of the preferred growth orientation of copper grains from (2 0 0) to (2 2 0) crystal face. Cu-Si ₃ N ₄ composite coatings presented lower friction coefficient and wear loss than pure copper deposit due to the increased hardness related to grain refinement strengthening and dispersion strengthening.

Original language	English (US)
Pages (from-to)	129-140
Number of pages	12
Journal	Applied Surface Science
Volume	300
DOIs	https://doi.org/10.1016/j.apsusc.2014.02.021
State	Published - May 1 2014
Externally published	Yes

Keywords

Copper matrix composite coating
Electrodeposition
Microstructure
Wear resistance

ASJC Scopus subject areas

General Chemistry
Condensed Matter Physics
General Physics and Astronomy
Surfaces and Interfaces
Surfaces, Coatings and Films

Online availability

10.1016/j.apsusc.2014.02.021

Library availability

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Cite this

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title = "Effect of electrodeposition conditions on the properties of Cu-Si3N4 composite coatings",

abstract = " Cu-Si 3 N 4 composite coatings were obtained by co-electrodeposition under DC conditions from a copper sulphate bath containing suspended Si 3 N 4 particles. The effect of some electroplating parameters such as surfactant (SDS) concentration, stirring rate, and particle concentration on microstructural and mechanical properties of the coatings was investigated. The incorporation of Si 3 N 4 particles into the copper matrix resulted in the production of coatings with finer copper grains. The incorporation of Si 3 N 4 particles also led to a change of the preferred growth orientation of copper grains from (2 0 0) to (2 2 0) crystal face. Cu-Si 3 N 4 composite coatings presented lower friction coefficient and wear loss than pure copper deposit due to the increased hardness related to grain refinement strengthening and dispersion strengthening.",

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author = "Maryam Eslami and Hassan Saghafian and Farhad Golestani-Fard and Alain Robin",

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AU - Eslami, Maryam

AU - Saghafian, Hassan

AU - Golestani-Fard, Farhad

AU - Robin, Alain

PY - 2014/5/1

Y1 - 2014/5/1

N2 - Cu-Si 3 N 4 composite coatings were obtained by co-electrodeposition under DC conditions from a copper sulphate bath containing suspended Si 3 N 4 particles. The effect of some electroplating parameters such as surfactant (SDS) concentration, stirring rate, and particle concentration on microstructural and mechanical properties of the coatings was investigated. The incorporation of Si 3 N 4 particles into the copper matrix resulted in the production of coatings with finer copper grains. The incorporation of Si 3 N 4 particles also led to a change of the preferred growth orientation of copper grains from (2 0 0) to (2 2 0) crystal face. Cu-Si 3 N 4 composite coatings presented lower friction coefficient and wear loss than pure copper deposit due to the increased hardness related to grain refinement strengthening and dispersion strengthening.

AB - Cu-Si 3 N 4 composite coatings were obtained by co-electrodeposition under DC conditions from a copper sulphate bath containing suspended Si 3 N 4 particles. The effect of some electroplating parameters such as surfactant (SDS) concentration, stirring rate, and particle concentration on microstructural and mechanical properties of the coatings was investigated. The incorporation of Si 3 N 4 particles into the copper matrix resulted in the production of coatings with finer copper grains. The incorporation of Si 3 N 4 particles also led to a change of the preferred growth orientation of copper grains from (2 0 0) to (2 2 0) crystal face. Cu-Si 3 N 4 composite coatings presented lower friction coefficient and wear loss than pure copper deposit due to the increased hardness related to grain refinement strengthening and dispersion strengthening.

KW - Copper matrix composite coating

KW - Electrodeposition

KW - Microstructure

KW - Wear resistance

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