Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere

Lei Zhang; Guangwei Sun; Li Li; J. K. Shang

doi:10.1109/ICEPT.2007.4441423

Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere

Lei Zhang, Guangwei Sun, Li Li, J. K. Shang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The wetting behavior of SnPb solder on copper surface in absence of flux was investigated in a forming gas atmosphere (5% H₂ and 95% Ar). X-ray photoelectron spectroscopy (XPS) analysis indicated that Cu₂O oxide layer, 2.0 - 4.2 nm thick, was formed after exposing the milled and polished copper surface in air from 5 min to 5 hours. The wetting temperature did not change much after copper was exposed to air for more than 3 hours. Wetting took place when molten solder was in contact with reduced copper surfaces, the reaction between pure copper and tin followed afterward. The initial temperature of solder wetting on copper was close to the reduction temperature of Cu₂O and increased with the thickness of the surface oxide.

Original language	English (US)
Title of host publication	Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs	https://doi.org/10.1109/ICEPT.2007.4441423
State	Published - 2007
Externally published	Yes
Event	2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China Duration: Aug 14 2007 → Aug 17 2007

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other	2007 8th International Conference on Electronic Packaging Technology, ICEPT
Country/Territory	China
City	Shanghai
Period	8/14/07 → 8/17/07

ASJC Scopus subject areas

General Engineering

Online availability

10.1109/ICEPT.2007.4441423

Library availability

Discover UIUC Full Text

Cite this

Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere. / Zhang, Lei; Sun, Guangwei; Li, Li et al.
Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 2007. 4441423 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhang, L, Sun, G, Li, L & Shang, JK 2007, Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere. in Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT., 4441423, Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, Shanghai, China, 8/14/07. https://doi.org/10.1109/ICEPT.2007.4441423

@inproceedings{ba26fcc98c7e48c7aa51ca55f91a7040,

title = "Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere",

abstract = "The wetting behavior of SnPb solder on copper surface in absence of flux was investigated in a forming gas atmosphere (5% H2 and 95% Ar). X-ray photoelectron spectroscopy (XPS) analysis indicated that Cu2O oxide layer, 2.0 - 4.2 nm thick, was formed after exposing the milled and polished copper surface in air from 5 min to 5 hours. The wetting temperature did not change much after copper was exposed to air for more than 3 hours. Wetting took place when molten solder was in contact with reduced copper surfaces, the reaction between pure copper and tin followed afterward. The initial temperature of solder wetting on copper was close to the reduction temperature of Cu2O and increased with the thickness of the surface oxide.",

author = "Lei Zhang and Guangwei Sun and Li Li and Shang, {J. K.}",

year = "2007",

doi = "10.1109/ICEPT.2007.4441423",

language = "English (US)",

isbn = "1424413923",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

booktitle = "Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT",

note = "2007 8th International Conference on Electronic Packaging Technology, ICEPT ; Conference date: 14-08-2007 Through 17-08-2007",

}

TY - GEN

T1 - Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere

AU - Zhang, Lei

AU - Sun, Guangwei

AU - Li, Li

AU - Shang, J. K.

PY - 2007

Y1 - 2007

N2 - The wetting behavior of SnPb solder on copper surface in absence of flux was investigated in a forming gas atmosphere (5% H2 and 95% Ar). X-ray photoelectron spectroscopy (XPS) analysis indicated that Cu2O oxide layer, 2.0 - 4.2 nm thick, was formed after exposing the milled and polished copper surface in air from 5 min to 5 hours. The wetting temperature did not change much after copper was exposed to air for more than 3 hours. Wetting took place when molten solder was in contact with reduced copper surfaces, the reaction between pure copper and tin followed afterward. The initial temperature of solder wetting on copper was close to the reduction temperature of Cu2O and increased with the thickness of the surface oxide.

AB - The wetting behavior of SnPb solder on copper surface in absence of flux was investigated in a forming gas atmosphere (5% H2 and 95% Ar). X-ray photoelectron spectroscopy (XPS) analysis indicated that Cu2O oxide layer, 2.0 - 4.2 nm thick, was formed after exposing the milled and polished copper surface in air from 5 min to 5 hours. The wetting temperature did not change much after copper was exposed to air for more than 3 hours. Wetting took place when molten solder was in contact with reduced copper surfaces, the reaction between pure copper and tin followed afterward. The initial temperature of solder wetting on copper was close to the reduction temperature of Cu2O and increased with the thickness of the surface oxide.

UR - http://www.scopus.com/inward/record.url?scp=50249139055&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50249139055&partnerID=8YFLogxK

U2 - 10.1109/ICEPT.2007.4441423

DO - 10.1109/ICEPT.2007.4441423

M3 - Conference contribution

AN - SCOPUS:50249139055

SN - 1424413923

SN - 9781424413928

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT

T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT

Y2 - 14 August 2007 through 17 August 2007

ER -

Effect of copper oxide layer on solder wetting temperature under a reduced atmosphere

Abstract

Publication series

Other

ASJC Scopus subject areas

Online availability

Library availability

Related links

Fingerprint

Cite this