Effect of annealing treatment on the dry sliding wear behavior of copper

Wenjun Cai; Pascal Bellon

doi:10.1016/j.wear.2019.01.014

Effect of annealing treatment on the dry sliding wear behavior of copper

Research output: Contribution to journal › Article › peer-review

Abstract

The effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as–received and annealed samples under 0.1–10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 µm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.

Original language	English (US)
Pages (from-to)	1187-1194
Number of pages	8
Journal	Wear
Volume	426-427
DOIs	https://doi.org/10.1016/j.wear.2019.01.014
State	Published - Apr 30 2019

Keywords

Copper
Dynamic recrystallization
EBSD
Sliding wear

ASJC Scopus subject areas

Condensed Matter Physics
Mechanics of Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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@article{a5325bd4de824ab080de4ee0ea23acf8,

title = "Effect of annealing treatment on the dry sliding wear behavior of copper",

abstract = "The effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as–received and annealed samples under 0.1–10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 µm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.",

keywords = "Copper, Dynamic recrystallization, EBSD, Sliding wear",

author = "Wenjun Cai and Pascal Bellon",

year = "2019",

month = apr,

day = "30",

doi = "10.1016/j.wear.2019.01.014",

language = "English (US)",

volume = "426-427",

pages = "1187--1194",

journal = "Wear",

issn = "0043-1648",

publisher = "Elsevier BV",

}

TY - JOUR

T1 - Effect of annealing treatment on the dry sliding wear behavior of copper

AU - Cai, Wenjun

AU - Bellon, Pascal

PY - 2019/4/30

Y1 - 2019/4/30

N2 - The effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as–received and annealed samples under 0.1–10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 µm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.

AB - The effect of annealing on the wear behavior of commercial grade pure copper (Cu) was evaluated by performing unlubricated pin-on-disc wear tests of as–received and annealed samples under 0.1–10 kgf normal load. It was found that annealing at 800 °C for 24 h led to an increase of grain size of Cu from ~ 6.7 to ~ 15.3 µm and a decrease in hardness. Wear rates of both samples increased while the friction coefficients decreased with increasing normal load. Subsurface microstructure evolution and wear debris were characterized by high resolution electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) after wear tests. Dynamic recrystallization and abnormal subsurface grain growth were observed in both samples under high load. Finally, the effect of annealing on the microstructure evolution and wear resistance of Cu were discussed.

KW - Copper

KW - Dynamic recrystallization

KW - EBSD

KW - Sliding wear

UR - http://www.scopus.com/inward/record.url?scp=85059650240&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85059650240&partnerID=8YFLogxK

U2 - 10.1016/j.wear.2019.01.014

DO - 10.1016/j.wear.2019.01.014

M3 - Article

AN - SCOPUS:85059650240

VL - 426-427

SP - 1187

EP - 1194

JO - Wear

JF - Wear

SN - 0043-1648

ER -