TY - JOUR
T1 - Effect of Amine Hardener Molecular Structure on the Thermal Conductivity of Epoxy Resins
AU - Lv, Guangxin
AU - Jensen, Elynn
AU - Shen, Chengtian
AU - Yang, Kexin
AU - Evans, Christopher M.
AU - Cahill, David G.
N1 - This work was supported by a grant from the ALTANA Institute. This work was supported in part by the National Science Foundation Engineering Research Center for Power Optimization of Electro Thermal Systems (POETS) under cooperative agreement EEC-1449548. The sample preparation and measurements were performed in part in the Frederick Seitz Materials Research Laboratory Central Research Facilities at the University of Illinois.
PY - 2021/1/8
Y1 - 2021/1/8
N2 - Epoxy resins with enhanced thermal conductivity are in great demand to improve the thermal management of electrical motors. However, the thermal conductivity of epoxy resin is typically low, comparable to 0.2 W/(m K), and a predictive understanding of the connection between molecular structure and thermal conductivity is not yet established. In this work, we present data for the thermal conductivity of seven thermosets synthesized from one commercially available diepoxide (resorcinol diglycidyl ether) and seven phenylenediamines to systematically examine the dependence of thermal conductivity on the molecular structure of the phenylenediamine hardener. Variations in the molecular structure of phenylenediamines, for example, positions of amine groups and the addition of an electron-withdrawing group, produce up to a factor of 2 change in the thermal conductivity of the cured resins. The highest thermal conductivity of 0.27 W/(m K) is obtained with 5-chloro-m-phenylenediamine; the lowest thermal conductivity of 0.14 W/(m K) is obtained with o-phenylenediamine. Thermal conductivities of these seven epoxy resins are 10-40% lower than the prediction of the minimum thermal conductivity model.
AB - Epoxy resins with enhanced thermal conductivity are in great demand to improve the thermal management of electrical motors. However, the thermal conductivity of epoxy resin is typically low, comparable to 0.2 W/(m K), and a predictive understanding of the connection between molecular structure and thermal conductivity is not yet established. In this work, we present data for the thermal conductivity of seven thermosets synthesized from one commercially available diepoxide (resorcinol diglycidyl ether) and seven phenylenediamines to systematically examine the dependence of thermal conductivity on the molecular structure of the phenylenediamine hardener. Variations in the molecular structure of phenylenediamines, for example, positions of amine groups and the addition of an electron-withdrawing group, produce up to a factor of 2 change in the thermal conductivity of the cured resins. The highest thermal conductivity of 0.27 W/(m K) is obtained with 5-chloro-m-phenylenediamine; the lowest thermal conductivity of 0.14 W/(m K) is obtained with o-phenylenediamine. Thermal conductivities of these seven epoxy resins are 10-40% lower than the prediction of the minimum thermal conductivity model.
KW - electric vehicles
KW - epoxy resin
KW - minimum thermal conductivity model
KW - molecular structure
KW - thermal conductivity
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U2 - 10.1021/acsapm.0c01074
DO - 10.1021/acsapm.0c01074
M3 - Article
AN - SCOPUS:85097823376
SN - 2637-6105
VL - 3
SP - 259
EP - 267
JO - ACS Applied Polymer Materials
JF - ACS Applied Polymer Materials
IS - 1
ER -