Effect of additives on shape evolution during electrodeposition: III. Trench infill for on-chip interconnects

Yan Qin, Xiaohai Li, Feng Xue, Philippe M. Vereecken, Panayotis Andricacos, Hariklia Deligianni, Richard D. Braatz, Richard C. Alkire

Research output: Contribution to journal › Article › peer-review

Fingerprint

Dive into the research topics of 'Effect of additives on shape evolution during electrodeposition: III. Trench infill for on-chip interconnects'. Together they form a unique fingerprint.

Keyphrases

Engineering

Material Science

Chemical Engineering