Original language | English (US) |
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Article number | 9312914 |
Journal | IEEE Electrical Design of Advanced Packaging and Systems Symposium |
Volume | 2020-December |
DOIs | |
State | Published - Dec 14 2020 |
Event | 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020 - Virtual, Shenzhen, China Duration: Dec 14 2020 → Dec 16 2020 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering
- Automotive Engineering
- General Computer Science