Dynamic failure of microelectromechanical systems

J. Kimberley, I. Chasiotis, J. Lambros

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Microelectromechanical systems (MEMS) are seeing increased usage in harsh mechanical environments that may subject the devices to highly transient dynamic loading. Characterizing the mechanical response of these systems under high-rate loading will lead to improved design criteria and better device survivability under extreme loading conditions. Devices manufactured using the Sandia SUMMiT™ process were tested using a pulsed laser-loading set-up, subjecting the devices to accelerations on the order of 1×10 9 g's for several nanoseconds (g: acceleration due to gravity). Scanning electron microscopy was used to investigate failure of the MEMS structures by comparing images from before and after loading. Different failure modes such as delamination of multi layered structures and material failure (fracture) were observed as a function of loading rate and device geometry.

Original languageEnglish (US)
Title of host publicationProceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Pages1350-1352
Number of pages3
StatePublished - 2006
EventSEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006 - Saint Louis, MO, United States
Duration: Jun 4 2006Jun 7 2006

Publication series

NameProceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Volume3

Other

OtherSEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Country/TerritoryUnited States
CitySaint Louis, MO
Period6/4/066/7/06

ASJC Scopus subject areas

  • General Engineering

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