TY - GEN
T1 - Dynamic failure of microelectromechanical systems
AU - Kimberley, J.
AU - Chasiotis, I.
AU - Lambros, J.
PY - 2006
Y1 - 2006
N2 - Microelectromechanical systems (MEMS) are seeing increased usage in harsh mechanical environments that may subject the devices to highly transient dynamic loading. Characterizing the mechanical response of these systems under high-rate loading will lead to improved design criteria and better device survivability under extreme loading conditions. Devices manufactured using the Sandia SUMMiT™ process were tested using a pulsed laser-loading set-up, subjecting the devices to accelerations on the order of 1×10 9 g's for several nanoseconds (g: acceleration due to gravity). Scanning electron microscopy was used to investigate failure of the MEMS structures by comparing images from before and after loading. Different failure modes such as delamination of multi layered structures and material failure (fracture) were observed as a function of loading rate and device geometry.
AB - Microelectromechanical systems (MEMS) are seeing increased usage in harsh mechanical environments that may subject the devices to highly transient dynamic loading. Characterizing the mechanical response of these systems under high-rate loading will lead to improved design criteria and better device survivability under extreme loading conditions. Devices manufactured using the Sandia SUMMiT™ process were tested using a pulsed laser-loading set-up, subjecting the devices to accelerations on the order of 1×10 9 g's for several nanoseconds (g: acceleration due to gravity). Scanning electron microscopy was used to investigate failure of the MEMS structures by comparing images from before and after loading. Different failure modes such as delamination of multi layered structures and material failure (fracture) were observed as a function of loading rate and device geometry.
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M3 - Conference contribution
AN - SCOPUS:33750324123
SN - 091205395X
SN - 9780912053950
T3 - Proceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
SP - 1350
EP - 1352
BT - Proceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
T2 - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Y2 - 4 June 2006 through 7 June 2006
ER -