Dynamic delamination testing of patterned thin films: A combined experimental and numerical study

P. Tran, S. V. Kandula, Philippe H Geubelle, Nancy R Sottos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel combined experimental/numerical protocol is proposed to extract the fracture toughness of thin films used in microelectronics and other engineering applications. The testing method involves the dynamic delamination of a patterned thin film initiated by a laser-induced pressure pulse applied on the backside of the substrate. The kinetic energy imparted by the pulse to a weakly bonded (pre-cracked) region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion. To support these experiments and extract the interface fracture toughness values, we develop a numerical scheme based on the combination of a spectral scheme used to model the elastodynamic response of the substrate and an explicit finite element scheme used to capture the dynamic response of the thin film. A cohesive failure model is adopted to couple the solutions in the two domains and to simulate the spontaneous propagation of the delamination front.

Original languageEnglish (US)
Title of host publication12th International Conference on Fracture 2009, ICF-12
Pages4955-4964
Number of pages10
StatePublished - Dec 1 2009
Event12th International Conference on Fracture 2009, ICF-12 - Ottawa, ON, Canada
Duration: Jul 12 2009Jul 17 2009

Publication series

Name12th International Conference on Fracture 2009, ICF-12
Volume7

Other

Other12th International Conference on Fracture 2009, ICF-12
CountryCanada
CityOttawa, ON
Period7/12/097/17/09

ASJC Scopus subject areas

  • Geotechnical Engineering and Engineering Geology

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