Dynamic adhesion test to measure thin film interface fracture toughness

Keyphrases

• Delamination 100%
• Adhesion Test 100%
• Thin Film Interface 100%
• Interface Fracture Toughness 100%
• Dynamic Adhesion 100%
• Weak Adhesion 50%
• Debonding 50%
• Interface Toughness 50%
• Crack Initiation 50%
• Thin Substrate 50%
• Film-substrate Interface 50%
• Inertial Force 50%
• Complete Description 50%
• Critical Energy 50%
• Laser-induced Stress Wave 50%
• Interfacial Failure 50%
• Energy Balance 50%
• Interfacial Crack Propagation 50%
• Stable Propagation 50%
• Substrate Combinations 50%
• Crack Tip Location 50%

Engineering

• Thin Films 100%
• Fracture Strength 100%
• Delamination 66%
• Crack Propagation 33%
• Crack Tip 33%
• Experimental Technique 33%
• Debonding 33%
• Induced Stress 33%
• Crack Initiation 33%
• Substrate Interface 33%
• Inertial Force 33%
• Conventional Method 33%
• Stress Wave 33%
• Interfacial Crack 33%
• Complete Description 33%
• Adhesion Region 33%

Material Science

• Thin Films 100%
• Film 100%
• Fracture Toughness 100%
• Interface Fracture 100%
• Delamination 66%
• Crack Tip 33%
• Crack Propagation 33%
• Debonding 33%
• Crack Initiation 33%