Dynamic adhesion test to measure thin film interface fracture toughness

S. S.V. Kandula, P. H. Geubelle, N. R. Sottos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel experimental technique is developed to measure thin film interface toughness using laser-induced stress waves. Controlled crack initiation is attained by selectively debonding a weak adhesion region beneath the film. The inertial forces acting on the debonded portion of the film lead to stable propagation of the delamination along the film/substrate interface. A simple energy balance is used to extract the critical energy for interfacial failure, a quantity that is difficult and sometimes impossible to characterize by more conventional methods for many thin film/substrate combinations. A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event.

Original languageEnglish (US)
Title of host publicationSociety for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Pages36-37
Number of pages2
StatePublished - Dec 22 2008
Event11th International Congress and Exhibition on Experimental and Applied Mechanics 2008 - Orlando, FL, United States
Duration: Jun 2 2008Jun 5 2008

Publication series

NameSociety for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
Volume1

Other

Other11th International Congress and Exhibition on Experimental and Applied Mechanics 2008
CountryUnited States
CityOrlando, FL
Period6/2/086/5/08

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials

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