Dummy fill density analysis with coupling constraints

Hua Xiang, Liang Deng, Ruchir Puri, Kai Yuan Chao, Martin D.F. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution


In modern VLSI manufacturing processes, dummy fills are widely used to adjust local metal density in order to improve layout uniformity and yield optimization. However, the introduction of a large amount of dummy features also affects wire electrical properties. In this paper, we propose the first Coupling constrained Dummy Fill (CDF) analysis algorithm which identifies feasible locations for dummy fills such that the fill induced coupling capacitance can be bounded within the given coupling threshold of each wire segment. The algorithm also makes efforts to maximize ground dummy fills, which are more robust and predictable. The output of the algorithm can be treated as the upper bound for dummy fill insertion, and it can be easily adopted in density models to guide dummy fill insertion without disturbing the existing design.

Original languageEnglish (US)
Title of host publicationProceedings of ISPD'07
Subtitle of host publication2007 International Symposium on Physical Design
Number of pages8
StatePublished - Oct 2 2007
EventISPD'07: 2007 International Symposium on Physical Design - Austin, TX, United States
Duration: Mar 18 2007Mar 21 2007

Publication series

NameProceedings of the International Symposium on Physical Design


OtherISPD'07: 2007 International Symposium on Physical Design
Country/TerritoryUnited States
CityAustin, TX


  • CMP
  • Coupling
  • Dummy fills

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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