Abstract
Improving energy efficiency is crucial for both mobile and high-performance computing systems while a large fraction of total energy is consumed to transfer data between storage and processing units. Thus, reducing data transfers across the memory hierarchy of a processor (i.e., off-chip memory, on-chip caches, and register file) can greatly improve the energy efficiency. To this end, we propose an architecture, DRAMA, that 3D-stacks coarse-grain reconfigurable accelerators (CGRAs) atop off-chip DRAM devices. DRAMA does not require changes to the DRAM device architecture, apart from through-silicon vias (TSVs) that connect the DRAM device's internal I/O bus to the CGRA layer. We demonstrate that DRAMA can reduce the energy consumption to transfer data across the memory hierarchy by 66-95 percent while achieving speedups of up to 18× over a commodity processor.
Original language | English (US) |
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Article number | 6846276 |
Pages (from-to) | 26-29 |
Number of pages | 4 |
Journal | IEEE Computer Architecture Letters |
Volume | 14 |
Issue number | 1 |
DOIs | |
State | Published - Jan 1 2015 |
Externally published | Yes |
Keywords
- 3D-stacking
- DRAM
- Near memory processing
- accelerator
- energy-efficient computing
ASJC Scopus subject areas
- Hardware and Architecture