Draft Final Report: Novel Technology for Resource Recovery and Waste Treatment in Printed Circuit Board Manufacturing

Eichrom Industries

Research output: Book/Report/Conference proceedingTechnical report

Abstract

In 1995, operating under a Cooperative Research and Development Agreement (CRADA) between Argonne National Laboratory, Wayne Circuits, Inc. and Eichrom Industries, Inc., a process was devised to treat and recycle printed circuit board waste by Argonne scientists. The purpose of this project was to transfer the knowledge learned about treating this waste that had been developed in the laboratory to an operating pilot unit in service in the Wayne Circuits manufacturing facility. The objective of the study was to gain sufficient operating experience treating plant waste to determine process limitations and what features would be required to convert the process from pilot-scale to plant operating scale.
Original languageEnglish (US)
Place of PublicationChampaign, IL
PublisherIllinois Waste Management and Research Center
StatePublished - Apr 15 1997

Keywords

  • Printed circuits industry -- Recycling
  • Factory and trade waste -- Recycling
  • Metals -- Recycling
  • Printed circuits industry -- Pollution prevention -- Case studies

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