TY - GEN
T1 - Domain decomposition and multi-scale finite elements for electromagnetic analysis of integrated electronic systems
AU - Cangellaris, Andreas C.
AU - Wu, Hong
PY - 2005/12/1
Y1 - 2005/12/1
N2 - A finite element methodology is presented for computer-aided analysis and design of the interconnect and power distribution network of integrated, packaged electronic systems. The concept of multi-scale finite elements is introduced to describe the generalization of the traditional finite element, understood as a small finite volume of the computational domain over which the unknown field quantity is approximated in terms of interpolative polynomial functions, to a generalized, electromagnetic behavior-baring, scaleable, mathematical macro-model, which captures the electromagnetic response of a sub-region of the computational domain, in a manner seamlessly compatible with the finite element modeling infrastructure. Such generalized finite elements, combined with a domain decomposition methodology suitable for multi-layered electronic substrate electromagnetic modeling, help enhance the modeling versatility and applicability of finite elements to integrated electronic system modeling.
AB - A finite element methodology is presented for computer-aided analysis and design of the interconnect and power distribution network of integrated, packaged electronic systems. The concept of multi-scale finite elements is introduced to describe the generalization of the traditional finite element, understood as a small finite volume of the computational domain over which the unknown field quantity is approximated in terms of interpolative polynomial functions, to a generalized, electromagnetic behavior-baring, scaleable, mathematical macro-model, which captures the electromagnetic response of a sub-region of the computational domain, in a manner seamlessly compatible with the finite element modeling infrastructure. Such generalized finite elements, combined with a domain decomposition methodology suitable for multi-layered electronic substrate electromagnetic modeling, help enhance the modeling versatility and applicability of finite elements to integrated electronic system modeling.
KW - Electromagnetic modeling
KW - Finite elements
KW - Macromodeling
KW - Package electrical modeling
KW - Signal integrity analysis
UR - http://www.scopus.com/inward/record.url?scp=33746610614&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33746610614&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2005.1513637
DO - 10.1109/ISEMC.2005.1513637
M3 - Conference contribution
AN - SCOPUS:33746610614
SN - 0780393805
SN - 9780780393806
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 817
EP - 822
BT - 2005 International Symposium on Electromagnetic Compatibility, EMC 2005
T2 - 2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Y2 - 8 August 2005 through 12 August 2005
ER -