Distributed on-chip power grid modeling: An electromagnetic alternative to RLC extraction-based models

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A methodology is presented for on-chip power grid modeling with uncompromised electromagnetic accuracy. The proposed methodology avoids the painstaking and error-prone process of power grid inductance extraction. Furthermore, the model is developed directly from the differential form of Maxwell's equations, and thus avoids the dense-matrix issues that arise when PEEC-based electromagnetic models are utilized. Finally, it has the unique attribute that, in addition to providing for on-chip power switching modeling with electromagnetic accuracy it enables the direct modeling of distributed power-grid induced electromagnetic interference.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages37-40
Number of pages4
ISBN (Electronic)0780381289, 9780780381285
DOIs
StatePublished - 2003
EventElectrical Performance of Electronic Packaging, 2003 - Princeton, United States
Duration: Oct 27 2003Oct 29 2003

Publication series

NameElectrical Performance of Electronic Packaging

Other

OtherElectrical Performance of Electronic Packaging, 2003
Country/TerritoryUnited States
CityPrinceton
Period10/27/0310/29/03

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

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