Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu

P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang

doi:10.1016/j.scriptamat.2008.03.031

Directional growth of Cu₃Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu

P. J. Shang, Z. Q. Liu, D. X. Li, J. K. Shang

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

The growth mechanisms of Cu₃Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (1 0 0) Cu the interfacial reaction during reflow resulted in a columnar growth of Cu₃Sn along Cu [1 0 0] with a special crystallographic relationship of (2 over(1, ̄) 0)_{Cu3 Sn} ∥ (over(4, ̄) 0 2)_Cu and [1 2 2]_{Cu3 Sn} ∥ [0 1 0]_Cu. In the subsequent solid-state aging new triangular Cu₃Sn grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent Cu₃Sn grains.

Original language	English (US)
Pages (from-to)	317-320
Number of pages	4
Journal	Scripta Materialia
Volume	59
Issue number	3
DOIs	https://doi.org/10.1016/j.scriptamat.2008.03.031
State	Published - Aug 2008

Keywords

CuSn
Growth
Interface
Soldering
Transmission electron microscopy (TEM)

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Online availability

10.1016/j.scriptamat.2008.03.031

Library availability

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Cite this

@article{ab9812c2a89a4aabaeefdc92a20b0ea0,

title = "Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu",

abstract = "The growth mechanisms of Cu3Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (1 0 0) Cu the interfacial reaction during reflow resulted in a columnar growth of Cu3Sn along Cu [1 0 0] with a special crystallographic relationship of (2 over(1,{\= }) 0)Cu3 Sn ∥ (over(4,{\= }) 0 2)Cu and [1 2 2]Cu3 Sn ∥ [0 1 0]Cu. In the subsequent solid-state aging new triangular Cu3Sn grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent Cu3Sn grains.",

keywords = "CuSn, Growth, Interface, Soldering, Transmission electron microscopy (TEM)",

author = "Shang, {P. J.} and Liu, {Z. Q.} and Li, {D. X.} and Shang, {J. K.}",

note = "Funding Information: The authors gratefully acknowledge the financial support from the National Natural Science Foundation of China under Grant Nos. 50228101 and 50571100, and the National Basic Research Program of China under Grant Nos. 2004CB619306 and 2002CB613503.",

year = "2008",

month = aug,

doi = "10.1016/j.scriptamat.2008.03.031",

language = "English (US)",

volume = "59",

pages = "317--320",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "3",

}

TY - JOUR

T1 - Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu

AU - Shang, P. J.

AU - Liu, Z. Q.

AU - Li, D. X.

AU - Shang, J. K.

N1 - Funding Information: The authors gratefully acknowledge the financial support from the National Natural Science Foundation of China under Grant Nos. 50228101 and 50571100, and the National Basic Research Program of China under Grant Nos. 2004CB619306 and 2002CB613503.

PY - 2008/8

Y1 - 2008/8

N2 - The growth mechanisms of Cu3Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (1 0 0) Cu the interfacial reaction during reflow resulted in a columnar growth of Cu3Sn along Cu [1 0 0] with a special crystallographic relationship of (2 over(1, ̄) 0)Cu3 Sn ∥ (over(4, ̄) 0 2)Cu and [1 2 2]Cu3 Sn ∥ [0 1 0]Cu. In the subsequent solid-state aging new triangular Cu3Sn grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent Cu3Sn grains.

AB - The growth mechanisms of Cu3Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (1 0 0) Cu the interfacial reaction during reflow resulted in a columnar growth of Cu3Sn along Cu [1 0 0] with a special crystallographic relationship of (2 over(1, ̄) 0)Cu3 Sn ∥ (over(4, ̄) 0 2)Cu and [1 2 2]Cu3 Sn ∥ [0 1 0]Cu. In the subsequent solid-state aging new triangular Cu3Sn grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent Cu3Sn grains.

KW - CuSn

KW - Growth

KW - Interface

KW - Soldering

KW - Transmission electron microscopy (TEM)

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DO - 10.1016/j.scriptamat.2008.03.031

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