Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu

P. J. Shang, Z. Q. Liu, D. X. Li, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

The growth mechanisms of Cu3Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (1 0 0) Cu the interfacial reaction during reflow resulted in a columnar growth of Cu3Sn along Cu [1 0 0] with a special crystallographic relationship of (2 over(1, ̄) 0)Cu3 Sn ∥ (over(4, ̄) 0 2)Cu and [1 2 2]Cu3 Sn ∥ [0 1 0]Cu. In the subsequent solid-state aging new triangular Cu3Sn grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent Cu3Sn grains.

Original languageEnglish (US)
Pages (from-to)317-320
Number of pages4
JournalScripta Materialia
Volume59
Issue number3
DOIs
StatePublished - Aug 2008
Externally publishedYes

Keywords

  • CuSn
  • Growth
  • Interface
  • Soldering
  • Transmission electron microscopy (TEM)

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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