Abstract
Specific non-wetting lines with a definite width of 200μm were prepared on copper substrates. The dewetting of SnAgCu lead-free liquids on the non-wetting line was observed and recorded in situ during the reflow of the samples. It was found that the shapes of the solder liquids varied with the height of the printed solder paste. As the height decreased from 950μm, the separation length of the liquid along the non-wetting line was elongated gradually. For the solder paste with a height of 350μm, the liquid sphere cap was completely separated by the non-wetting line. The dependence of the critical height of the solder liquid on the width of non-wetting line was proposed based on interfacial energy minimization. The experiment agreed with the critical height for a 200μm non-wetting line calculated accordingly. These results gave a clear hint on the origin of solder bridging.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1298-1302 |
| Number of pages | 5 |
| Journal | Jinshu Xuebao/Acta Metallurgica Sinica |
| Volume | 42 |
| Issue number | 12 |
| State | Published - Dec 2006 |
| Externally published | Yes |
Keywords
- Dewetting
- Lead-free solder
- Solder bridge
- Wetting
ASJC Scopus subject areas
- Geotechnical Engineering and Engineering Geology
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys