Development of three-dimensional inductors using plastic deformation magnetic assembly (PDMA)

Jun Zou, Chang Liu, Drew R. Trainor, Jack Chen, Jose E. Schutt-Ainé, Patrick L. Chapman

Research output: Contribution to journalArticlepeer-review


On-chip inductors are critical for enabling portable power-efficient wireless communication systems. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large footprints. In this paper, we discuss the development of two types of on-chip three-dimensional (3-D) inductors - a vertical spiral inductor and a solenoid inductor - by using a 3-D assembly process called plastic deformation magnetic assembly. Prototype vertical spiral inductors and solenoid inductors have been fabricated and tested. Experimental results show that the vertical spiral inductors can achieve better performance and a smaller footprint than the in-plane ones.

Original languageEnglish (US)
Pages (from-to)1067-1075
Number of pages9
JournalIEEE Transactions on Microwave Theory and Techniques
Issue number4 I
StatePublished - Apr 2003


  • On-chip solenoid inductor
  • Plastic deformation magnetic assembly (PDMA)
  • Three-dimensional (3-D) assembly
  • Vertical spiral inductor

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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