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Development of flip-chip 1300 nm VCSELs

  • Duane A. Louderback
  • , Richard V. Stone
  • , Kati G. Graham
  • , Peter S. Guilfoyle
  • , Kent D. Choquette
  • , John F. Klem
  • , Darwin K. Serkland

Research output: Contribution to journalConference articlepeer-review

Abstract

We present results on the development of monolithic 1300 nm VCSELs designed for flip-chip bonding. Nearly identical top- and bottom-emitting VCSEL structures were utilized to evaluate the performance of flip-chip VCSELs.

Original languageEnglish (US)
Pages (from-to)691-692
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume2
StatePublished - 2002
Event2002 IEEE/LEOS Annual Meeting Conference Proceedings: 15th Annual Meeting of the IEEE Lasers and Electro-Optics Society - Glasgow, United Kingdom
Duration: Nov 10 2002Nov 14 2002

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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