Development of analysis techniques to characterize heat transfer of adhesive-bonded fins

M. K. Heun, R. R. Crawford, M. K. Smith, T. A. Newell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Development of analysis techniques to characterize heat transfer of adhesive-bonded fins'. Together they form a unique fingerprint.

Keyphrases

Engineering