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Development of a compliant nanothermal interface material
David Shaddock
, Stanton Weaver
,
Ioannis Chasiotis
, Binoy Shah
, Dalong Zhong
Aerospace Engineering
Mechanical Science and Engineering
Micro and Nanotechnology Lab
Research output
:
Chapter in Book/Report/Conference proceeding
›
Conference contribution
Overview
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Keyphrases
Interface Material
100%
Nanosprings
100%
Nanothermal
100%
Thermal Interface Materials
75%
Soldering
75%
Thermal Resistance
75%
Bondline
75%
Bondline Thickness
50%
Solder Layer
50%
Order of Magnitude
25%
High Thermal Conductivity
25%
Fabrication Methods
25%
Effective Thermal Conductivity
25%
Power Density
25%
Thermal Stress
25%
Thermal Expansion
25%
Performance Test
25%
Department of Defense
25%
US Government
25%
Fatigue Stress
25%
High Thermal Conductivity Materials
25%
Compliant Structures
25%
Mating Surfaces
25%
Process Test
25%
Engineering
Material Interface
100%
Bondlines
100%
Heat Resistance
60%
High Thermal Conductivity
40%
Effective Thermal Conductivity
20%
Power Density
20%
Thermal Stress
20%
Fatigue Stress
20%
Performance Testing
20%
Department of Defense
20%
Mating Surface
20%
Material Science
Interface (Material)
100%
Thermal Conductivity
60%
Heat Resistance
60%
Density
20%
Silicon
20%
Thermal Expansion
20%
Thermal Stress
20%
Surface (Surface Science)
20%